In situ electronic board testing

Capabilities

Our areas of expertise:

• CAD processing using Test-Expert (All CAD)
• Bed of nails or flying probe (Keysight, SPEA, Teradyne, etc.)
• Mechanical design:
  • Bed of nails interface
  • Double level (mechanical, pneumatic, vacuum, etc.)
  • Xprobe technology
• Electronic board design:
  •  Relay, adaptation, communication, sensor
• Software development
  • ICT, JTAG, programming, FCT
• Specific HMI design:
  • Panel management, operator instructions

Testing expertise and technologies implemented:

• Design For Test (DFT)/testability report
• BoundaryScan/JTAG test
• Component programming
• Complete automation or integration of cobotics
• Flying probe test systems
• Bed of nails test interface (double level)
• Knowledge of the main testers: Teradyne TS, Testation, Spectrum, SPEA, Keysight 3070, Seica Flying Probe